HCF4009UBM1 vs CD4009UBDMSH feature comparison

HCF4009UBM1 STMicroelectronics

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CD4009UBDMSH Harris Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS HARRIS SEMICONDUCTOR
Part Package Code SOIC
Package Description SOP, SOP16,.25 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature HIGH TO LOW LEVEL TRANSLATOR RADIATION HARDENED; WITH EXTENDED INPUT VOLTAGE; IOL = 2.1MA @ VOL = 0.4V; IOH = 0.58MA @ VOH = 2.5V
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-CDIP-T16
JESD-609 Code e4 e0
Length 9.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type INVERTER INVERTER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Prop. Delay@Nom-Sup 140 ns 189 ns
Propagation Delay (tpd) 140 ns 81 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 20 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology MOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish NICKEL PALLADIUM GOLD Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm
Base Number Matches 1 2
Max I(ol) 0.00035999999999999997 A
Screening Level 38535V;38534K;883S
Total Dose 1M Rad(Si) V

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Compare CD4009UBDMSH with alternatives