HCF4001BEY vs MC14001UBALDS feature comparison

HCF4001BEY STMicroelectronics

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MC14001UBALDS Motorola Semiconductor Products

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS MOTOROLA INC
Part Package Code DIP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer STMicroelectronics
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-GDIP-T14
JESD-609 Code e4 e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Packing Method TUBE
Prop. Delay@Nom-Sup 200 ns
Propagation Delay (tpd) 200 ns 180 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.1 mm 5.08 mm
Supply Voltage-Max (Vsup) 20 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Length 19.495 mm

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