HCC4555BF
vs
5962R9667301VEC
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
STMICROELECTRONICS
RENESAS ELECTRONICS CORP
Part Package Code
DIP
Package Description
FRIT SEALED, CERAMIC, DIP-16
DIP,
Pin Count
16
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
R-GDIP-T16
R-CDIP-T16
JESD-609 Code
e0
e4
Load Capacitance (CL)
50 pF
Logic IC Type
2-LINE TO 4-LINE DECODER
2-LINE TO 4-LINE DECODER
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
440 ns
Propagation Delay (tpd)
440 ns
594 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
GOLD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Length
19.05 mm
Screening Level
MIL-PRF-38535 Class V
Total Dose
100k Rad(Si) V
Compare HCC4555BF with alternatives
Compare 5962R9667301VEC with alternatives