HC6616/2KVHZC
vs
HC6616/1KVHZT
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
HONEYWELL MICROELECTRONICS AND PRECISION SENSORS
|
HONEYWELL MICROELECTRONICS AND PRECISION SENSORS
|
| Part Package Code |
DFP
|
DFP
|
| Package Description |
DFP,
|
DFP,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
105 ns
|
55 ns
|
| Additional Feature |
RADIATION-HARDENED ROM
|
RADIATION-HARDENED ROM
|
| JESD-30 Code |
R-CDFP-F24
|
R-CDFP-F24
|
| Length |
15.1384 mm
|
15.1384 mm
|
| Memory Density |
4096 bit
|
2048 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
8
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
512
|
512
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
512X8
|
512X4
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.175 mm
|
3.175 mm
|
| Supply Current-Max |
0.185 mA
|
0.007 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.16 mm
|
10.16 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare HC6616/2KVHZC with alternatives
Compare HC6616/1KVHZT with alternatives