HC55185FCM
vs
HC55185DIMZ
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
LCC
|
PLCC
|
| Package Description |
PLASTIC, MS-018AB, LCC-28
|
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQCC-J28
|
|
| JESD-609 Code |
e0
|
e3
|
| Length |
11.505 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
|
| Number of Terminals |
28
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QCCJ
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.57 mm
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
BIPOLAR
|
|
| Telecom IC Type |
SLIC
|
SLIC
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
J BEND
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
11.505 mm
|
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
N28.45
|
| Date Of Intro |
|
2017-10-20
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare HC55185FCM with alternatives
Compare HC55185DIMZ with alternatives