HC55185ECRZ
vs
HC55185CIMZ
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
Part Package Code |
QFN
|
PLCC
|
Package Description |
7 X 7 MM, LEAD FREE, PLASTIC, MO-220VKKC, QFN-32
|
QCCJ, LDCC28,.5SQ
|
Pin Count |
32
|
28
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Battery Feed |
CONSTANT CURRENT
|
CONSTANT CURRENT
|
Battery Supply |
+75 V
|
+100 V
|
Hybrid |
2-4 CONVERSION
|
2-4 CONVERSION
|
JESD-30 Code |
S-PQCC-N32
|
S-PQCC-J28
|
JESD-609 Code |
e3
|
e3
|
Length |
7 mm
|
11.505 mm
|
Moisture Sensitivity Level |
3
|
3
|
Noise-Max |
13 dBrnC
|
13 dBrnC
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
28
|
Operating Temperature-Max |
75 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
PSRR-Min |
45 dB
|
45 dB
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
QCCJ
|
Package Equivalence Code |
LCC32,.27SQ,25
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
4.57 mm
|
Supply Current-Max |
0.0135 mA
|
0.0135 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Telecom IC Type |
SLIC
|
SLIC
|
Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
Terminal Form |
NO LEAD
|
J BEND
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
7 mm
|
11.505 mm
|
Base Number Matches |
2
|
2
|
Factory Lead Time |
|
26 Weeks
|
Peak Reflow Temperature (Cel) |
|
245
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare HC55185ECRZ with alternatives
Compare HC55185CIMZ with alternatives