HC55185ECM
vs
HC55185ECMZ
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Contact Manufacturer
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
INTERSIL CORP
|
| Part Package Code |
LCC
|
PLCC
|
| Package Description |
PLASTIC, MS-018AB, LCC-28
|
QCCJ, LDCC28,.5SQ
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
e3
|
| Length |
11.505 mm
|
11.505 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Telecom IC Type |
SLIC
|
SLIC
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
11.505 mm
|
11.505 mm
|
| Base Number Matches |
2
|
2
|
| Battery Feed |
|
CONSTANT CURRENT
|
| Battery Supply |
|
+75 V
|
| Hybrid |
|
2-4 CONVERSION
|
| Noise-Max |
|
13 dBrnC
|
| PSRR-Min |
|
45 dB
|
| Package Equivalence Code |
|
LDCC28,.5SQ
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Supply Current-Max |
|
0.0135 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare HC55185ECM with alternatives
Compare HC55185ECMZ with alternatives