HC55185DIMZ
vs
HC55185FCR96
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
| Part Package Code |
PLCC
|
QFN
|
| Pin Count |
28
|
32
|
| Manufacturer Package Code |
N28.45
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2017-10-20
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
3
|
1
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Telecom IC Type |
SLIC
|
SLIC
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
7 X 7 MM, PLASTIC, MO-220VKKC, QFN-32
|
| Battery Feed |
|
CONSTANT CURRENT/RESISTIVE
|
| Battery Supply |
|
-24 AND -75 V
|
| Hybrid |
|
2-4 CONVERSION
|
| JESD-30 Code |
|
S-PQCC-N32
|
| Length |
|
7 mm
|
| Noise-Max |
|
14 dBrnC
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
32
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HVQCCN
|
| Package Equivalence Code |
|
LCC32,.27SQ,25
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1 mm
|
| Supply Current-Max |
|
0.0135 mA
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BIPOLAR
|
| Temperature Grade |
|
OTHER
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
7 mm
|
|
|
|
Compare HC55185DIMZ with alternatives
Compare HC55185FCR96 with alternatives