HC55185DIMZ
vs
HC5517IM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
HARRIS SEMICONDUCTOR
Part Package Code
PLCC
Pin Count
28
Manufacturer Package Code
N28.45
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
2017-10-20
Samacsys Manufacturer
Renesas Electronics
JESD-609 Code
e3
e0
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
245
Telecom IC Type
SLIC
SLIC
Terminal Finish
Matte Tin (Sn) - annealed
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
2
2
Battery Feed
RESISTIVE
Battery Supply
-24 V
Hybrid
2-4 CONVERSION
JESD-30 Code
S-PQCC-J28
Number of Functions
1
Number of Terminals
28
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
PSRR-Min
20 dB
Package Body Material
PLASTIC/EPOXY
Package Code
QCCJ
Package Equivalence Code
LDCC28,.5SQ
Package Shape
SQUARE
Package Style
CHIP CARRIER
Qualification Status
Not Qualified
Supply Current-Max
6 mA
Supply Voltage-Nom
5 V
Surface Mount
YES
Technology
BIPOLAR
Temperature Grade
INDUSTRIAL
Terminal Form
J BEND
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Compare HC55185DIMZ with alternatives
Compare HC5517IM with alternatives