HC55185BIMZ
vs
HC55171CM
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
Part Package Code |
PLCC
|
|
Package Description |
QCCJ, LDCC28,.5SQ
|
PLASTIC, LCC-28
|
Pin Count |
28
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Battery Feed |
CONSTANT CURRENT
|
RESISTIVE
|
Battery Supply |
+85 V
|
-24 V
|
Hybrid |
2-4 CONVERSION
|
2-4 CONVERSION
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e3
|
e0
|
Length |
11.505 mm
|
11.505 mm
|
Moisture Sensitivity Level |
3
|
|
Noise-Max |
13 dBrnC
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
75 °C
|
Operating Temperature-Min |
-40 °C
|
|
PSRR-Min |
45 dB
|
33 dB
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
245
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Current-Max |
0.0135 mA
|
0.006 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Telecom IC Type |
SLIC
|
SLIC
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN LEAD
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
11.505 mm
|
11.505 mm
|
Base Number Matches |
2
|
3
|
|
|
|
Compare HC55185BIMZ with alternatives
Compare HC55171CM with alternatives