HC55184ECMZR4749
vs
HC55171IB
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
Part Package Code |
LCC
|
SOIC
|
Package Description |
QCCJ, LDCC28,.5SQ
|
SOIC-28
|
Pin Count |
28
|
28
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Battery Feed |
CONSTANT CURRENT
|
RESISTIVE
|
Battery Supply |
-25 AND -75 V
|
-24 V
|
Hybrid |
2-4 CONVERSION
|
2-4 CONVERSION
|
JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G28
|
JESD-609 Code |
e3
|
e0
|
Length |
11.505 mm
|
17.9 mm
|
Moisture Sensitivity Level |
3
|
|
Noise-Max |
19 dBrnC
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
SOP
|
Package Equivalence Code |
LDCC28,.5SQ
|
SOP28,.4
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
245
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
2.65 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Telecom IC Type |
SLIC
|
SLIC
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
11.505 mm
|
7.5 mm
|
Base Number Matches |
2
|
3
|
PSRR-Min |
|
33 dB
|
Supply Current-Max |
|
0.006 mA
|
|
|
|
Compare HC55184ECMZR4749 with alternatives
Compare HC55171IB with alternatives