HC5517IB vs HC55182DIM feature comparison

HC5517IB Harris Semiconductor

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HC55182DIM Intersil Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR INTERSIL CORP
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Battery Feed RESISTIVE
Battery Supply -24 V
Hybrid 2-4 CONVERSION
JESD-30 Code R-PDSO-G28 S-PQCC-J28
JESD-609 Code e0
Number of Functions 1 1
Number of Terminals 28 28
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PSRR-Min 20 dB
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP QCCJ
Package Equivalence Code SOP28,.4
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Supply Current-Max 6 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR
Telecom IC Type SLIC SLIC
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING J BEND
Terminal Pitch 1.27 mm
Terminal Position DUAL QUAD
Base Number Matches 3 3
Package Description PLASTIC, LCC-28
Factory Lead Time 4 Weeks

Compare HC5517IB with alternatives

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