HC55171CB
vs
HC55180DIM
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOIC-28
|
|
| Pin Count |
28
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Battery Feed |
RESISTIVE
|
|
| Battery Supply |
-24 V
|
|
| Hybrid |
2-4 CONVERSION
|
|
| JESD-30 Code |
R-PDSO-G28
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
75 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PSRR-Min |
33 dB
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
|
| Package Equivalence Code |
SOP28,.4
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.006 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
|
| Telecom IC Type |
SLIC
|
SLIC
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare HC55171CB with alternatives
Compare HC55180DIM with alternatives