HB56SW872ESN-6B
vs
SM572084094E3S6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HITACHI LTD
SMART MODULAR TECHNOLOGIES
Package Description
DIMM, DIMM168
DIMM-168
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
FAST PAGE WITH EDO
FAST PAGE WITH EDO
Access Time-Max
60 ns
60 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type
COMMON
JESD-30 Code
R-XDMA-N168
R-XDMA-N168
Memory Density
603979776 bit
603979776 bit
Memory IC Type
EDO DRAM MODULE
EDO DRAM MODULE
Memory Width
72
72
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
168
168
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
8MX72
8MX72
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Equivalence Code
DIMM168
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
Seated Height-Max
31.75 mm
Standby Current-Max
0.036 A
Supply Current-Max
1.89 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
MOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Part Package Code
DIMM
Pin Count
168
Compare HB56SW872ESN-6B with alternatives
Compare SM572084094E3S6 with alternatives