HB56SW864DBK-7
vs
MB8508S064AE-100DG
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HITACHI LTD
|
FUJITSU LTD
|
Part Package Code |
MODULE
|
|
Package Description |
DIMM, DIMM144,32
|
,
|
Pin Count |
144
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.28
|
8542.32.00.28
|
Access Mode |
FAST PAGE WITH EDO
|
SINGLE BANK PAGE BURST
|
Access Time-Max |
70 ns
|
8.5 ns
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-XDMA-N144
|
R-PDMA-N144
|
Memory Density |
536870912 bit
|
536870912 bit
|
Memory IC Type |
EDO DRAM MODULE
|
SYNCHRONOUS DRAM MODULE
|
Memory Width |
64
|
64
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
144
|
144
|
Number of Words |
8388608 words
|
8388608 words
|
Number of Words Code |
8000000
|
8000000
|
Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
8MX64
|
8MX64
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
DIMM
|
|
Package Equivalence Code |
DIMM144,32
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
4096
|
|
Self Refresh |
NO
|
YES
|
Standby Current-Max |
0.032 A
|
|
Supply Current-Max |
1.2 mA
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3.15 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.8 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
2
|
Additional Feature |
|
AUTO/SELF REFRESH
|
|
|
|
Compare HB56SW864DBK-7 with alternatives
Compare MB8508S064AE-100DG with alternatives