HB56S872ESN-8B vs DPSD8MX72RW-10C feature comparison

HB56S872ESN-8B Hitachi Ltd

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DPSD8MX72RW-10C B&B Electronics Manufacturing Company

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HITACHI LTD DPAC TECHNOLOGIES CORP
Part Package Code DIMM
Package Description DIMM, DIMM168 ,
Pin Count 168
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode FAST PAGE WITH EDO FOUR BANK PAGE BURST
Access Time-Max 80 ns 7 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH AUTO REFRESH
Alternate Memory Width 36
I/O Type COMMON
JESD-30 Code R-XDMA-N168 R-XDMA-N168
Memory Density 603979776 bit 603979776 bit
Memory IC Type EDO DRAM MODULE SYNCHRONOUS DRAM MODULE
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 168 168
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8MX72 8MX72
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM
Package Equivalence Code DIMM168
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 4096
Seated Height-Max 25.4 mm
Standby Current-Max 0.036 A
Supply Current-Max 1.53 mA
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology MOS CMOS
Temperature Grade COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1

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