HB56R872ES-6B vs M372V0883DJ0-C50 feature comparison

HB56R872ES-6B Hitachi Ltd

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M372V0883DJ0-C50 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HITACHI LTD SAMSUNG SEMICONDUCTOR INC
Part Package Code DIMM DIMM
Package Description DIMM, DIMM168 DIMM, DIMM168
Pin Count 168 168
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode FAST PAGE FAST PAGE
Access Time-Max 60 ns 50 ns
Additional Feature RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type COMMON COMMON
JESD-30 Code R-XDMA-N168 R-XDMA-N168
Memory Density 603979776 bit 603979776 bit
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 168 168
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8MX72 8MX72
Output Characteristics 3-STATE 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Equivalence Code DIMM168 DIMM168
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 4096 8192
Seated Height-Max 25.4 mm
Standby Current-Max 0.1 A 0.03 A
Supply Current-Max 1.594 mA 0.99 mA
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1

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Compare M372V0883DJ0-C50 with alternatives