HB56R872ES-6B vs KMM375S823CT-GL0 feature comparison

HB56R872ES-6B Hitachi Ltd

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KMM375S823CT-GL0 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HITACHI LTD SAMSUNG SEMICONDUCTOR INC
Part Package Code DIMM DIMM
Package Description DIMM, DIMM168 DIMM,
Pin Count 168 168
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode FAST PAGE FOUR BANK PAGE BURST
Access Time-Max 60 ns 6 ns
Additional Feature RAS ONLY/CAS BEFORE RAS REFRESH AUTO/SELF REFRESH
I/O Type COMMON
JESD-30 Code R-XDMA-N168 R-XDMA-N168
Memory Density 603979776 bit 603979776 bit
Memory IC Type FAST PAGE DRAM MODULE SYNCHRONOUS DRAM MODULE
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 168 168
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8MX72 8MX72
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Equivalence Code DIMM168
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 4096
Seated Height-Max 25.4 mm
Standby Current-Max 0.1 A
Supply Current-Max 1.594 mA
Supply Voltage-Max (Vsup) 5.25 V 3.6 V
Supply Voltage-Min (Vsup) 4.75 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Self Refresh YES

Compare HB56R872ES-6B with alternatives

Compare KMM375S823CT-GL0 with alternatives