HB56H232B-7N
vs
KMM5322100BKU/BKUG-7
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HITACHI LTD
SAMSUNG SEMICONDUCTOR INC
Part Package Code
MODULE
SIMM
Package Description
SIMM, SSIM72
SIMM,
Pin Count
72
72
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FAST PAGE WITH EDO
FAST PAGE
Access Time-Max
70 ns
70 ns
I/O Type
COMMON
JESD-30 Code
R-XSMA-N72
R-XSMA-N72
Memory Density
67108864 bit
67108864 bit
Memory IC Type
EDO DRAM MODULE
FAST PAGE DRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
72
72
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
2MX32
2MX32
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
SIMM
SIMM
Package Equivalence Code
SSIM72
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
1024
Seated Height-Max
25.4 mm
Self Refresh
NO
Standby Current-Max
0.004 A
Supply Current-Max
0.31 mA
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
SINGLE
SINGLE
Base Number Matches
1
1
Compare HB56H232B-7N with alternatives
Compare KMM5322100BKU/BKUG-7 with alternatives