HB56D172EJ-8B
vs
MB721BT08TADG60
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HITACHI LTD
|
MOTOROLA INC
|
Part Package Code |
DIMM
|
DIMM
|
Package Description |
,
|
DIMM, DIMM168
|
Pin Count |
168
|
168
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.02
|
8542.32.00.02
|
Access Mode |
FAST PAGE
|
FAST PAGE WITH EDO
|
Access Time-Max |
80 ns
|
60 ns
|
Additional Feature |
RAS ONLY/CAS BEFORE RAS REFRESH
|
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
|
Alternate Memory Width |
36
|
36
|
JESD-30 Code |
R-XDMA-N168
|
R-XDMA-N168
|
Memory Density |
75497472 bit
|
75497472 bit
|
Memory IC Type |
FAST PAGE DRAM MODULE
|
EDO DRAM MODULE
|
Memory Width |
72
|
72
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
168
|
168
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
1MX72
|
1MX72
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIMM
|
DIMM
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
1024
|
1024
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
MOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
I/O Type |
|
COMMON
|
Package Equivalence Code |
|
DIMM168
|
Self Refresh |
|
NO
|
Standby Current-Max |
|
0.006 A
|
Standby Voltage-Min |
|
4.5 V
|
Supply Current-Max |
|
0.89 mA
|
Terminal Pitch |
|
1.27 mm
|
|
|
|
Compare HB56D172EJ-8B with alternatives
Compare MB721BT08TADG60 with alternatives