HB56AW1672E-5
vs
SM572164008E4G6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HITACHI LTD
SMART MODULAR TECHNOLOGIES
Part Package Code
DIMM
DIMM
Package Description
DIMM, DIMM168
DIMM-168
Pin Count
168
168
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
FAST PAGE
FAST PAGE
Access Time-Max
50 ns
60 ns
I/O Type
COMMON
JESD-30 Code
R-XDMA-N168
R-XDMA-N168
Memory Density
1207959552 bit
1207959552 bit
Memory IC Type
FAST PAGE DRAM MODULE
FAST PAGE DRAM MODULE
Memory Width
72
72
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
168
168
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16MX72
16MX72
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Equivalence Code
DIMM168
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
Seated Height-Max
31.75 mm
Standby Current-Max
0.019 A
Supply Current-Max
1.99 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Compare HB56AW1672E-5 with alternatives
Compare SM572164008E4G6 with alternatives