HB56A272E-5
vs
MSC23V27207TD-70BS9
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HITACHI LTD
|
OKI ELECTRIC INDUSTRY CO LTD
|
Part Package Code |
DIMM
|
DIMM
|
Package Description |
DIMM, DIMM168
|
,
|
Pin Count |
168
|
168
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.24
|
8542.32.00.24
|
Access Mode |
FAST PAGE
|
FAST PAGE
|
Access Time-Max |
50 ns
|
70 ns
|
Additional Feature |
RAS ONLY/CAS BEFORE RAS REFRESH
|
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-XDMA-N168
|
R-XDMA-N168
|
Memory Density |
150994944 bit
|
150994944 bit
|
Memory IC Type |
FAST PAGE DRAM MODULE
|
FAST PAGE DRAM MODULE
|
Memory Width |
72
|
72
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
168
|
168
|
Number of Words |
2097152 words
|
2097152 words
|
Number of Words Code |
2000000
|
2000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
2MX72
|
2MX72
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIMM
|
DIMM
|
Package Equivalence Code |
DIMM168
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
2048
|
|
Seated Height-Max |
25.4 mm
|
|
Self Refresh |
NO
|
|
Standby Current-Max |
0.073 A
|
|
Supply Current-Max |
1.054 mA
|
|
Supply Voltage-Max (Vsup) |
5.25 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
1
|
1
|
|
|
|
Compare HB56A272E-5 with alternatives
Compare MSC23V27207TD-70BS9 with alternatives