HADC574ZBMJ
vs
MX574AKEPI+
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
HONEYWELL MICROELECTRONICS AND PRECISION SENSORS
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP28,.6
|
ROHS COMPLIANT, PLASTIC, DIP-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
20 V
|
10 V
|
| Converter Type |
A/D CONVERTER
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-XDIP-T28
|
R-PDIP-T28
|
| JESD-609 Code |
e0
|
e3
|
| Linearity Error-Max (EL) |
0.024%
|
0.0122%
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Bit Code |
OFFSET BINARY
|
BINARY, OFFSET BINARY
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP28,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Analog Input Voltage-Min |
|
-10 V
|
| Conversion Time-Max |
|
25 µs
|
| Length |
|
36.83 mm
|
| Moisture Sensitivity Level |
|
1
|
| Negative Supply Voltage-Nom |
|
-15 V
|
| Output Format |
|
PARALLEL, WORD
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Sample and Hold / Track and Hold |
|
SAMPLE
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Nom |
|
15 V
|
| Technology |
|
BICMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
15.24 mm
|
|
|
|
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