HA5234IJ
vs
MC33274AP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MOTOROLA INC
Package Description
DIP, DIP14,.3
PLASTIC, DIP-14
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
Common-mode Reject Ratio-Min
100 dB
80 dB
Frequency Compensation
YES
Input Offset Voltage-Max
500 µV
1800 µV
JESD-30 Code
R-CDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e0
Low-Offset
YES
Micropower
YES
Neg Supply Voltage Limit-Max
-18 V
-18 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Functions
4
4
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Slew Rate-Nom
0.15 V/us
10 V/us
Supply Current-Max
2.9 mA
12 mA
Supply Voltage Limit-Max
18 V
18 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
800
24000
Voltage Gain-Min
250000
19952.6
Base Number Matches
2
5
Average Bias Current-Max (IIB)
0.8 µA
Common-mode Reject Ratio-Nom
100 dB
Length
18.86 mm
Seated Height-Max
4.69 mm
Slew Rate-Min
8 V/us
Width
7.62 mm
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