H5TQ2G63FFR-H9J
vs
K4B2G1646C-HCF80
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SK HYNIX INC
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
TFBGA, BGA96,9X16,32
|
HALOGEN FREE AND ROHS COMPLIANT, FBGA-96
|
Pin Count |
96
|
96
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.36
|
|
Access Mode |
MULTI BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
Access Time-Max |
0.255 ns
|
0.3 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
Clock Frequency-Max (fCLK) |
667 MHz
|
533 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
4,8
|
4,8
|
JESD-30 Code |
R-PBGA-B96
|
R-PBGA-B96
|
Length |
13 mm
|
13.3 mm
|
Memory Density |
2147483648 bit
|
2147483648 bit
|
Memory IC Type |
DDR3 DRAM
|
DDR DRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
96
|
96
|
Number of Words |
134217728 words
|
134217728 words
|
Number of Words Code |
128000000
|
128000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
128MX16
|
128MX16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA96,9X16,32
|
BGA96,9X16,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
8192
|
8192
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Self Refresh |
YES
|
|
Sequential Burst Length |
4,8
|
4,8
|
Standby Current-Max |
0.012 A
|
0.012 A
|
Supply Current-Max |
0.2 mA
|
0.22 mA
|
Supply Voltage-Max (Vsup) |
1.575 V
|
1.575 V
|
Supply Voltage-Min (Vsup) |
1.425 V
|
1.425 V
|
Supply Voltage-Nom (Vsup) |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
7.5 mm
|
7.5 mm
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
Power Supplies |
|
1.5 V
|
|
|
|
Compare H5TQ2G63FFR-H9J with alternatives
Compare K4B2G1646C-HCF80 with alternatives