H5TQ2G63BFR-PBJ vs MT41K128M16JT-187EM:K feature comparison

H5TQ2G63BFR-PBJ SK Hynix Inc

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MT41K128M16JT-187EM:K Micron Technology Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SK HYNIX INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description TFBGA, BGA96,9X16,32 TFBGA,
Pin Count 96 96
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 0.225 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 800 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e1 e1
Length 13 mm 14 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type DDR3 DRAM DDR3L DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 96 96
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128MX16 128MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Sequential Burst Length 4,8
Standby Current-Max 0.012 A
Supply Current-Max 0.21 mA
Supply Voltage-Max (Vsup) 1.575 V 1.45 V
Supply Voltage-Min (Vsup) 1.425 V 1.283 V
Supply Voltage-Nom (Vsup) 1.5 V 1.35 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 9 mm 8 mm
Base Number Matches 1 1

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