H5TQ1G43BFR-H9C
vs
EDJ2104BCSE-AE-F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
Package Description
TFBGA, BGA78,9X13,32
FBGA, BGA78,9X13,32
Pin Count
78
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.36
Access Mode
MULTI BANK PAGE BURST
Access Time-Max
20 ns
0.3 ns
Additional Feature
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
667 MHz
533 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
4,8
4,8
JESD-30 Code
R-PBGA-B78
R-PBGA-B78
JESD-609 Code
e1
Length
11 mm
Memory Density
1073741824 bit
2147483648 bit
Memory IC Type
DDR3 DRAM
DDR3 DRAM
Memory Width
4
4
Number of Functions
1
Number of Ports
1
Number of Terminals
78
78
Number of Words
268435456 words
536870912 words
Number of Words Code
256000000
512000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
256MX4
512MX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Equivalence Code
BGA78,9X13,32
BGA78,9X13,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
8192
Seated Height-Max
1.2 mm
Self Refresh
YES
Sequential Burst Length
4,8
4,8
Supply Voltage-Max (Vsup)
1.575 V
Supply Voltage-Min (Vsup)
1.425 V
Supply Voltage-Nom (Vsup)
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
7.5 mm
Base Number Matches
1
2
Standby Current-Max
0.015 A
Supply Current-Max
0.235 mA
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