H5TQ1G43AFPR-H8C
vs
K4B2G0446C-HCF80
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
TFBGA, BGA78,9X13,32
Pin Count
78
78
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.36
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B78
R-PBGA-B78
Length
11.5 mm
11 mm
Memory Density
1073741824 bit
2147483648 bit
Memory IC Type
DDR DRAM
DDR3 DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
78
78
Number of Words
268435456 words
536870912 words
Number of Words Code
256000000
512000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
256MX4
512MX4
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.575 V
1.575 V
Supply Voltage-Min (Vsup)
1.425 V
1.425 V
Supply Voltage-Nom (Vsup)
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
7.5 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Access Time-Max
0.3 ns
Clock Frequency-Max (fCLK)
533 MHz
I/O Type
COMMON
Interleaved Burst Length
8
JESD-609 Code
e1
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
BGA78,9X13,32
Peak Reflow Temperature (Cel)
260
Refresh Cycles
8192
Sequential Burst Length
8
Standby Current-Max
0.012 A
Supply Current-Max
0.16 mA
Terminal Finish
TIN SILVER COPPER
Compare H5TQ1G43AFPR-H8C with alternatives
Compare K4B2G0446C-HCF80 with alternatives