H5TC4G63EFR-PBL
vs
H5TC4G63EFR-RDJ
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SK HYNIX INC
|
SK HYNIX INC
|
Package Description |
FBGA-96
|
FBGA-96
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.36
|
8542.32.00.36
|
Access Mode |
MULTI BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
JESD-30 Code |
R-PBGA-B96
|
R-PBGA-B96
|
Length |
13 mm
|
13 mm
|
Memory Density |
4294967296 bit
|
4294967296 bit
|
Memory IC Type |
DDR3L DRAM
|
DDR3L DRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
96
|
96
|
Number of Words |
268435456 words
|
268435456 words
|
Number of Words Code |
256000000
|
256000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
95 °C
|
95 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
256MX16
|
256MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Self Refresh |
YES
|
YES
|
Supply Voltage-Max (Vsup) |
1.45 V
|
1.45 V
|
Supply Voltage-Min (Vsup) |
1.283 V
|
1.283 V
|
Supply Voltage-Nom (Vsup) |
1.35 V
|
1.35 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
7.5 mm
|
7.5 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare H5TC4G63EFR-PBL with alternatives
Compare H5TC4G63EFR-RDJ with alternatives