H5TC1G83BFR-H9A
vs
MT41J512M8THD-15
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA78,9X13,32
TFBGA,
Pin Count
78
78
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.24
Access Mode
MULTI BANK PAGE BURST
DUAL BANK PAGE BURST
Access Time-Max
0.255 ns
1.5 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
667 MHz
I/O Type
COMMON
Interleaved Burst Length
4,8
JESD-30 Code
R-PBGA-B78
R-PBGA-B78
JESD-609 Code
e1
e1
Length
11 mm
11.5 mm
Memory Density
1073741824 bit
268435456 bit
Memory IC Type
DDR3L DRAM
DDR3 DRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
78
78
Number of Words
134217728 words
33554432 words
Number of Words Code
128000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
128MX8
32MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA78,9X13,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Sequential Burst Length
4,8
Supply Current-Max
0.19 mA
Supply Voltage-Max (Vsup)
1.45 V
1.575 V
Supply Voltage-Min (Vsup)
1.283 V
1.425 V
Supply Voltage-Nom (Vsup)
1.35 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
7.5 mm
8 mm
Base Number Matches
1
1
Compare H5TC1G83BFR-H9A with alternatives
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