H5MS2562JFR-K3M
vs
MT46V16M16BJ-75EH
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
8 X 10 MM, 1 MM HEIGHT, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60
TBGA,
Pin Count
60
60
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.24
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
Length
10 mm
16 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
DDR DRAM
DDR1 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-30 °C
Organization
16MX16
16MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.95 V
2.7 V
Supply Voltage-Min (Vsup)
1.7 V
2.3 V
Supply Voltage-Nom (Vsup)
1.8 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
8 mm
9 mm
Base Number Matches
1
1
Pbfree Code
Access Time-Max
0.75 ns
JESD-609 Code
e1
Refresh Cycles
8192
Supply Current-Max
0.16 mA
Terminal Finish
TIN SILVER COPPER
Compare H5MS2562JFR-K3M with alternatives
Compare MT46V16M16BJ-75EH with alternatives