H5DU2562GFR-K2L
vs
V54C3128164VBF7PC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
PROMOS TECHNOLOGIES INC
Part Package Code
BGA
BGA
Package Description
VBGA, BGA60,9X12,40/32
TFBGA, BGA60,8X15,32
Pin Count
60
60
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.02
Category CO2 Kg
12
12
Compliance Temperature Grade
Commercial: +0C to +70C
Commercial: +0C to +70C
EU RoHS Version
RoHS 2 (2011/65/EU)
RoHS 2 (2011/65/EU)
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.75 ns
5.4 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
133 MHz
143 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
2,4,8
1,2,4,8
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e1
Length
12 mm
13 mm
Memory Density
268435456 bit
134217728 bit
Memory IC Type
DDR1 DRAM
SYNCHRONOUS DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
16777216 words
8388608 words
Number of Words Code
16000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16MX16
8MX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VBGA
TFBGA
Package Equivalence Code
BGA60,9X12,40/32
BGA60,8X15,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
4096
Seated Height-Max
1 mm
1.2 mm
Self Refresh
YES
YES
Sequential Burst Length
2,4,8
1,2,4,8
Standby Current-Max
0.003 A
0.001 A
Supply Current-Max
0.2 mA
0.25 mA
Supply Voltage-Max (Vsup)
2.7 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
3 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Width
8 mm
8 mm
Base Number Matches
1
1
Pbfree Code
Candidate List Date
2016-06-20
Compare H5DU2562GFR-K2L with alternatives
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