H2512CPZ1051F30
vs
S2512CPX1051F30-W
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
Category CO2 Kg
4.54
4.54
Compliance Temperature Grade
Military: -65C to +150C
Military: -65C to +150C
EU RoHS Version
RoHS 2 (2015/863/EU)
EU RoHS Exemptions
7(c)-I
Candidate List Date
2020-06-25
2024-06-27
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.31
CMRT V6.31
Construction
Chip
Chip
JESD-609 Code
e4
e0
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Height
0.58 mm
0.58 mm
Package Length
6.35 mm
6.35 mm
Package Style
SMT
SMT
Package Width
3.02 mm
3.02 mm
Packing Method
Bulk
WAFFLE PACK
Rated Power Dissipation (P)
1.5 W
1.5 W
Resistance
1050 Ω
1050 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2512
2512
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
300 ppm/°C
300 ppm/°C
Terminal Finish
Gold (Au) - with Nickel (Ni) barrier
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Pbfree Code
Package Description
CHIP
HTS Code
8533.21.00.30
SVHC Over MCV
7439-92-1
Mounting Feature
SURFACE MOUNT
Package Shape
RECTANGULAR PACKAGE
Rated Temperature
70 °C
Surface Mount
YES
Terminal Shape
WRAPAROUND
Compare H2512CPZ1051F30 with alternatives
Compare S2512CPX1051F30-W with alternatives