H2512CPX8R45F20-W
vs
S2512CPC8R45F20
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STATE OF THE ART INC
|
STATE OF THE ART INC
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e0
|
e4
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Height |
0.58 mm
|
0.58 mm
|
| Package Length |
6.35 mm
|
6.35 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
3.02 mm
|
3.02 mm
|
| Packing Method |
Waffle Pack
|
BULK
|
| Rated Power Dissipation (P) |
1.5 W
|
1.5 W
|
| Resistance |
8.45 Ω
|
8.45 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
2512
|
2512
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
Silver (Ag)
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Package Description |
|
CHIP, ROHS COMPLIANT
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8533.21.00.30
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare H2512CPX8R45F20-W with alternatives
Compare S2512CPC8R45F20 with alternatives