H2512CPX1274F30-W
vs
H2512CPZ1274F30-TR
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Reach Compliance Code
not_compliant
compliant
Construction
Chip
Chip
JESD-609 Code
e0
e4
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Height
0.58 mm
0.58 mm
Package Length
6.35 mm
6.35 mm
Package Style
SMT
SMT
Package Width
3.02 mm
3.02 mm
Packing Method
Waffle Pack
TR
Rated Power Dissipation (P)
1.5 W
1.5 W
Resistance
1270000 Ω
1270000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2512
2512
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
300 ppm/°C
300 ppm/°C
Terminal Finish
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Gold (Au) - with Nickel (Ni) barrier
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
1
ECCN Code
EAR99
Compare H2512CPX1274F30-W with alternatives
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