H2512CPX1274F30-W vs H2512CPZ1274F30-TR feature comparison

H2512CPX1274F30-W State of the Art Inc

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H2512CPZ1274F30-TR State of the Art Inc

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer STATE OF THE ART INC STATE OF THE ART INC
Reach Compliance Code not_compliant compliant
Construction Chip Chip
JESD-609 Code e0 e4
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Height 0.58 mm 0.58 mm
Package Length 6.35 mm 6.35 mm
Package Style SMT SMT
Package Width 3.02 mm 3.02 mm
Packing Method Waffle Pack TR
Rated Power Dissipation (P) 1.5 W 1.5 W
Resistance 1270000 Ω 1270000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2512 2512
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 300 ppm/°C 300 ppm/°C
Terminal Finish Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier Gold (Au) - with Nickel (Ni) barrier
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
ECCN Code EAR99

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