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H2512CPX1051F30-W vs S2512CPG1051F30 feature comparison

H2512CPX1051F30-W State of the Art Inc

Buy Now Datasheet

S2512CPG1051F30 State of the Art Inc

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer STATE OF THE ART INC STATE OF THE ART INC
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e0 e4
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Height 0.58 mm 0.58 mm
Package Length 6.35 mm 6.35 mm
Package Style SMT SMT
Package Width 3.02 mm 3.02 mm
Packing Method Waffle Pack BULK
Rated Power Dissipation (P) 1.5 W 1.5 W
Resistance 1050 Ω 1050 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2512 2512
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 300 ppm/°C 300 ppm/°C
Terminal Finish Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier Gold (Au)
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Pbfree Code Yes
Package Description CHIP, ROHS COMPLIANT
HTS Code 8533.21.00.30
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

Compare H2512CPX1051F30-W with alternatives

Compare S2512CPG1051F30 with alternatives