H2512CA8984DHB-TR
vs
H2512CA8984DHB-W
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
STATE OF THE ART INC
|
STATE OF THE ART INC
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
Construction |
Chip
|
Chip
|
JESD-609 Code |
e0
|
e0
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Height |
0.64 mm
|
0.64 mm
|
Package Length |
6.6 mm
|
6.6 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
3.1 mm
|
3.1 mm
|
Packing Method |
TR
|
Waffle Pack
|
Rated Power Dissipation (P) |
1.5 W
|
1.5 W
|
Reference Standard |
MIL-PRF-55342
|
MIL-PRF-55342
|
Resistance |
8980000 Ω
|
8980000 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Size Code |
2612
|
2612
|
Technology |
THIN FILM
|
THIN FILM
|
Temperature Coefficient |
50 ppm/°C
|
50 ppm/°C
|
Terminal Finish |
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
Tolerance |
0.5%
|
0.5%
|
Working Voltage |
200 V
|
200 V
|
Base Number Matches |
1
|
1
|
|
|
|
Compare H2512CA8984DHB-TR with alternatives
Compare H2512CA8984DHB-W with alternatives