H2512CA1304BEW-W
vs
S2512CA1304BEB-W
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STATE OF THE ART INC
|
STATE OF THE ART INC
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e4
|
e0
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Height |
0.64 mm
|
0.64 mm
|
| Package Length |
6.6 mm
|
6.6 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
3.1 mm
|
3.1 mm
|
| Packing Method |
Waffle Pack
|
Waffle Pack
|
| Rated Power Dissipation (P) |
1.5 W
|
1.5 W
|
| Reference Standard |
MIL-PRF-55342
|
MIL-PRF-55342
|
| Resistance |
1300000 Ω
|
1300000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
2612
|
2612
|
| Technology |
THIN FILM
|
THIN FILM
|
| Temperature Coefficient |
25 ppm/°C
|
25 ppm/°C
|
| Terminal Finish |
Gold (Au)
|
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
| Tolerance |
0.1%
|
0.1%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare H2512CA1304BEW-W with alternatives
Compare S2512CA1304BEB-W with alternatives