H2010CPZ2874F30-W
vs
H2010CPG2874F30
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
STATE OF THE ART INC
|
STATE OF THE ART INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Construction |
Chip
|
Chip
|
JESD-609 Code |
e4
|
e4
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Height |
0.71 mm
|
0.71 mm
|
Package Length |
5.13 mm
|
5.13 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
2.38 mm
|
2.38 mm
|
Packing Method |
Waffle Pack
|
Bulk
|
Rated Power Dissipation (P) |
1 W
|
1 W
|
Resistance |
2870000 Ω
|
2870000 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Size Code |
2009
|
2009
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
300 ppm/°C
|
300 ppm/°C
|
Terminal Finish |
Gold (Au) - with Nickel (Ni) barrier
|
Gold (Au)
|
Tolerance |
1%
|
1%
|
Working Voltage |
150 V
|
150 V
|
Base Number Matches |
1
|
1
|
|
|
|
Compare H2010CPZ2874F30-W with alternatives
Compare H2010CPG2874F30 with alternatives