H2010CPG184K20-W
vs
H2010CUX184K20-W
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
STATE OF THE ART INC
|
STATE OF THE ART INC
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
Construction |
Chip
|
Chip
|
JESD-609 Code |
e4
|
e0
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Height |
0.71 mm
|
0.71 mm
|
Package Length |
5.13 mm
|
5.13 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
2.38 mm
|
2.38 mm
|
Packing Method |
Waffle Pack
|
Waffle Pack
|
Rated Power Dissipation (P) |
1 W
|
1 W
|
Resistance |
180000 Ω
|
180000 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Size Code |
2009
|
2009
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
Terminal Finish |
Gold (Au)
|
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
Tolerance |
10%
|
10%
|
Working Voltage |
150 V
|
150 V
|
Base Number Matches |
1
|
1
|
|
|
|
Compare H2010CPG184K20-W with alternatives
Compare H2010CUX184K20-W with alternatives