H2010CPG1151F10-TR
vs
S2010CPY1151F10-W
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
Construction
Chip
Chip
JESD-609 Code
e4
e4
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Height
0.71 mm
0.71 mm
Package Length
5.13 mm
5.13 mm
Package Style
SMT
SMT
Package Width
2.38 mm
2.38 mm
Packing Method
TR
Waffle Pack
Rated Power Dissipation (P)
1 W
1 W
Resistance
1150 Ω
1150 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2009
2009
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Gold (Au)
Silver (Ag) - with Nickel (Ni) barrier
Tolerance
1%
1%
Working Voltage
150 V
150 V
Base Number Matches
1
1
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