H2010CPG1151F10-TR vs S2010CPY1151F10-W feature comparison

H2010CPG1151F10-TR State of the Art Inc

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S2010CPY1151F10-W State of the Art Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer STATE OF THE ART INC STATE OF THE ART INC
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e4 e4
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Height 0.71 mm 0.71 mm
Package Length 5.13 mm 5.13 mm
Package Style SMT SMT
Package Width 2.38 mm 2.38 mm
Packing Method TR Waffle Pack
Rated Power Dissipation (P) 1 W 1 W
Resistance 1150 Ω 1150 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2009 2009
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Gold (Au) Silver (Ag) - with Nickel (Ni) barrier
Tolerance 1% 1%
Working Voltage 150 V 150 V
Base Number Matches 1 1

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