H2010CPC2874F30
vs
S2010CPG2874F30-W
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STATE OF THE ART INC
|
STATE OF THE ART INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e4
|
e4
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Height |
0.71 mm
|
0.71 mm
|
| Package Length |
5.13 mm
|
5.13 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.38 mm
|
2.38 mm
|
| Packing Method |
Bulk
|
Waffle Pack
|
| Rated Power Dissipation (P) |
1 W
|
1 W
|
| Resistance |
2870000 Ω
|
2870000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
2009
|
2009
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
300 ppm/°C
|
300 ppm/°C
|
| Terminal Finish |
Silver (Ag)
|
Gold (Au)
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
150 V
|
150 V
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare H2010CPC2874F30 with alternatives
Compare S2010CPG2874F30-W with alternatives