H1206CPX8064F10-W
vs
H1206CPZ8064F10-TR
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Package Description
CHIP
CHIP
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Construction
Rectangular
Rectangular
JESD-609 Code
e0
e4
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Package Height
0.46 mm
0.46 mm
Package Length
3.2 mm
3.2 mm
Package Style
SMT
SMT
Package Width
1.55 mm
1.55 mm
Packing Method
WAFFLE PACK
TR
Rated Power Dissipation (P)
0.25 W
0.25 W
Rated Temperature
70 °C
70 °C
Resistance
8060000 Ω
8060000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Gold (Au) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
100 V
100 V
Base Number Matches
1
1
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