H1206CPX17R8F30-W
vs
S1206CPC17R8F30-W
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STATE OF THE ART INC
|
STATE OF THE ART INC
|
| Package Description |
CHIP
|
CHIP
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8533.21.00.30
|
8533.21.00.30
|
| Construction |
Rectangular
|
Rectangular
|
| JESD-609 Code |
e0
|
e4
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Height |
0.46 mm
|
0.46 mm
|
| Package Length |
3.2 mm
|
3.2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.55 mm
|
1.55 mm
|
| Packing Method |
WAFFLE PACK
|
WAFFLE PACK
|
| Rated Power Dissipation (P) |
0.25 W
|
0.25 W
|
| Rated Temperature |
70 °C
|
70 °C
|
| Resistance |
17.8 Ω
|
17.8 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
1206
|
1206
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
300 ppm/°C
|
300 ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
Silver (Ag)
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
100 V
|
100 V
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare H1206CPX17R8F30-W with alternatives
Compare S1206CPC17R8F30-W with alternatives