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H1206CA3523DEB-W vs S1206CA3523DEB feature comparison

H1206CA3523DEB-W State of the Art Inc

Buy Now Datasheet

S1206CA3523DEB State of the Art Inc

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer STATE OF THE ART INC STATE OF THE ART INC
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e0 e0
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Height 0.38 mm 0.38 mm
Package Length 3.2 mm 3.2 mm
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method Waffle Pack BULK
Rated Power Dissipation (P) 0.3 W 0.3 W
Resistance 352000 Ω 352000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Terminal Finish Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Tolerance 0.5% 0.5%
Working Voltage 100 V 100 V
Base Number Matches 1 3
Pbfree Code No
Package Description CHIP
HTS Code 8533.21.00.30
Additional Feature PRECISION, REFERENCE STANDARD: MIL-PRF-55342
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND
Resistors » Thin Film Resistors
Resistors » Thin Film Resistors

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