H0705CPX6811F10-W
vs
H0705CPG6811F10-W
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
Construction
Chip
Chip
JESD-609 Code
e0
e4
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Package Height
0.46 mm
0.46 mm
Package Length
1.91 mm
1.91 mm
Package Style
SMT
SMT
Package Width
1.22 mm
1.22 mm
Packing Method
Waffle Pack
Waffle Pack
Rated Power Dissipation (P)
0.2 W
0.2 W
Resistance
6810 Ω
6810 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0805
0805
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Gold (Au)
Tolerance
1%
1%
Working Voltage
50 V
50 V
Base Number Matches
1
1
Compare H0705CPX6811F10-W with alternatives
Compare H0705CPG6811F10-W with alternatives