H0705CPX184K30-W
vs
H0705CPX184K30
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Reach Compliance Code
not_compliant
not_compliant
Construction
Chip
Chip
JESD-609 Code
e0
e0
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Package Height
0.46 mm
0.46 mm
Package Length
1.91 mm
1.91 mm
Package Style
SMT
SMT
Package Width
1.22 mm
1.22 mm
Packing Method
Waffle Pack
Bulk
Rated Power Dissipation (P)
0.2 W
0.2 W
Resistance
180000 Ω
180000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0805
0805
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
300 ppm/°C
300 ppm/°C
Terminal Finish
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Tolerance
10%
10%
Working Voltage
50 V
50 V
Base Number Matches
1
3
ECCN Code
EAR99
Compare H0705CPX184K30-W with alternatives
Compare H0705CPX184K30 with alternatives