H0603CPZ8R25F10
vs
S0603CPX8R25F10-TR
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
Construction
Chip
Chip
JESD-609 Code
e4
e0
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Height
0.46 mm
0.46 mm
Package Length
1.58 mm
1.58 mm
Package Style
SMT
SMT
Package Width
0.81 mm
0.81 mm
Packing Method
Bulk
TR
Rated Power Dissipation (P)
0.1 W
0.1 W
Resistance
8.25 Ω
8.25 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0603
0603
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Gold (Au) - with Nickel (Ni) barrier
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Tolerance
1%
1%
Working Voltage
45 V
45 V
Base Number Matches
1
1
Pbfree Code
No
Package Description
CHIP
HTS Code
8533.21.00.30
Mounting Feature
SURFACE MOUNT
Package Shape
RECTANGULAR PACKAGE
Rated Temperature
70 °C
Surface Mount
YES
Terminal Shape
WRAPAROUND
Compare H0603CPZ8R25F10 with alternatives
Compare S0603CPX8R25F10-TR with alternatives