H0603CPX8R25F10-TR vs S0603CPY8R25F10 feature comparison

H0603CPX8R25F10-TR State of the Art Inc

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S0603CPY8R25F10 State of the Art Inc

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer STATE OF THE ART INC STATE OF THE ART INC
Reach Compliance Code not_compliant compliant
Construction Chip Chip
JESD-609 Code e0 e4
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -65 °C -65 °C
Package Height 0.46 mm 0.46 mm
Package Length 1.58 mm 1.58 mm
Package Style SMT SMT
Package Width 0.81 mm 0.81 mm
Packing Method TR BULK
Rated Power Dissipation (P) 0.1 W 0.1 W
Resistance 8.25 Ω 8.25 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier Silver (Ag) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 45 V 45 V
Base Number Matches 1 1
Pbfree Code Yes
Package Description CHIP, ROHS COMPLIANT
ECCN Code EAR99
HTS Code 8533.21.00.30
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES

Compare H0603CPX8R25F10-TR with alternatives

Compare S0603CPY8R25F10 with alternatives