H0603CPX8R25F10-TR
vs
S0603CPY8R25F10
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STATE OF THE ART INC
STATE OF THE ART INC
Reach Compliance Code
not_compliant
compliant
Construction
Chip
Chip
JESD-609 Code
e0
e4
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Height
0.46 mm
0.46 mm
Package Length
1.58 mm
1.58 mm
Package Style
SMT
SMT
Package Width
0.81 mm
0.81 mm
Packing Method
TR
BULK
Rated Power Dissipation (P)
0.1 W
0.1 W
Resistance
8.25 Ω
8.25 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0603
0603
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Silver (Ag) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
45 V
45 V
Base Number Matches
1
1
Pbfree Code
Yes
Package Description
CHIP, ROHS COMPLIANT
ECCN Code
EAR99
HTS Code
8533.21.00.30
Mounting Feature
SURFACE MOUNT
Package Shape
RECTANGULAR PACKAGE
Rated Temperature
70 °C
Surface Mount
YES
Compare H0603CPX8R25F10-TR with alternatives
Compare S0603CPY8R25F10 with alternatives