H0505CA1891BHB-W
vs
M55342H02W1B89P-W
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STATE OF THE ART INC
|
STATE OF THE ART INC
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e0
|
e4
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Height |
0.38 mm
|
0.38 mm
|
| Package Length |
1.35 mm
|
1.32 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.23 mm
|
1.22 mm
|
| Packing Method |
Waffle Pack
|
WAFFLE PACK
|
| Rated Power Dissipation (P) |
0.125 W
|
0.05 W
|
| Resistance |
1890 Ω
|
1890 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0505
|
0505
|
| Technology |
THIN FILM
|
THIN FILM
|
| Temperature Coefficient |
50 ppm/°C
|
50 ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
|
Gold (Au)
|
| Tolerance |
0.1%
|
0.1%
|
| Working Voltage |
40 V
|
40 V
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
CHIP
|
| Additional Feature |
|
PRECISION
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
| Reference Standard |
|
MIL-PRF-55342
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare H0505CA1891BHB-W with alternatives
Compare M55342H02W1B89P-W with alternatives